Thanks to a high degree of automation, the latest machinery, highly qualified staff and seamless control / analysis, we keep our processes stable. Our decades of experience help us to make the right decisions.
Our circuit boards are manufactured in accordance with the valid IPC guidelines and standards (et al. IPC-A-600 class 2) and on the basis of the following technical specifications (tolerances). HDI- (High-Density-Interconnect) or MFT- (Micro Fineline Technology) boards can be produced with smaller tolerances.
Deviating specifications must be explicitly agreed!
The specified tolerances are the maximum deviations that can still be tolerated. Experience has shown that the PCBs actually manufactured are well within these maximum values.
The hole pattern for vias (DK) goes through all the layers of the circuit and therefore serves as a location reference for the other patterns.
| Type | Tolerance |
|---|---|
| Drilling pattern (PTH) to conductive pattern outer layers | ±0,10mm |
| Drilling pattern (PTH) to conductive pattern inner layers | ±0,15mm |
| Drilling pattern (PTH) to milling pattern / contour | ±0,10mm |
| Drilling pattern (NPTH) to milling pattern / contour | ±0,10mm |
| Drilling pattern (PTH) to legend print | ±0,15mm |
| Conductive pattern to solder resist | ±0,10mm |
| Conductive pattern to legend print | ±0,20mm |
| Hole to hole, one pass* (PTH-PTH or NPTH-NPTH) | ±0,05mm |
| Hole to hole, two passes (PTH-NPTH) | ±0,10mm |
* Also applies for PTH-NPTH if they are drilled in one run (e.g. location holes for SMD stencils).
| Type | Final-Ø |
|---|---|
| Plated-through-holes (PTH) and component holes | ±0,10mm |
| Non-plated-through-holes (NPTH) | ±0,08mm |
| Press-fit (drilled) | ±0,05mm |
| > on request | +0,10mm/-0mm |
| Press-fit (milled*) | ±0,075mm |
| Via type | Class 2 (standard) | class 3 |
|---|---|---|
| Via (> 150µm) | min. 20µm - 25µm | min. 20µm - 25µm |
| Microvia (≤ 150µm) | min. 18µm - 20µm | min. 20µm - 25µm |
| Blind Via | min. 10µm - 12µm | min. 10µm - 12µm |
| Buried Via | min. 10µm - 12µm | min. 10µm - 12µm |
| Type | Tolerance | Reference |
|---|---|---|
| Conductor width* | min. 80% | in comparsion to the data |
| Conductor space* | max. 30% reduction (standard) | in comparsion to the data |
| Type | Tolerance | Mode |
|---|---|---|
| Impedance control | 10% | normal |
| Impedance control | 5% | extended |
| Type | Tolerance |
|---|---|
| Milling offset | ±0,10mm |
| Z-Axis milling depth | ±0,20mm |
| Type | Tolerance |
|---|---|
| Offset (to PCB center) | ±0,10mm |
| Drilling pattern (PTH) to scoring pattern | ±0,15mm |
| Drilling pattern (NPTH) to scoring pattern | ±0,20mm |
| PCB dimension x/y | ±0,15mm |
| Scoring depth | ±0,20mm |
| Type | Tolerance |
|---|---|
| Base material thickness | ±10% |
The information about the base material thickness exclusively defines the thickness of the dielectric including base copper. The other layer structures such as electroplated Cu layers or solder resist layers result in increased final thickness.
| Type | Tolerance |
|---|---|
| Dielectric thickness ≥ 0,075mm | ±10% |
| 0,025mm ≤ Dielectric thickness ≥ 0,075mm | ±10% |
| 0,020mm ≤ Dielectric thickness ≥ 0,025mm | ±12,5% |
| Dielectric thickness < 0,020mm | ±15% |
| Adhesive thickness ≥ 0,075mm | ±10% |
| 0,025mm ≤ Adhesive thickness ≥ 0,075mm | ±15% |
| 0,020mm ≤ Adhesive thickness ≥ 0,025mm | ±20% |
| Adhesive thickness < 0,020mm | ±30% |
| For woven or combinations with woven stiffener: Adhesive thickness ≥ 0,025mm | ±20% |
Specifications according to IPC-4204A. The information on the thickness of the base material defines solely the dielectric thickness or adhesive thickness incl. base copper. The other layer structures such as e.g. galvanic Cu or solder-stop lead to an increased circuit final thickness.
| Type | Tolerance |
|---|---|
| Producibility level B (standard) | The higher value of ±10% or ±178µm |
Thickness tolerances for pressed multilayers according to IPC-2222A. When measured over metallizations or coatings, those thicknesses and tolerances must be considered.
| Type | Tolerance |
|---|---|
| Flexible part thickness | ±50µm |
| Flexible part + stiffener thickness | ±100µm |
| For PCBs ≥ 0,8mm thickness | Tolerance |
|---|---|
| with SMD | 0,75% |
| without SMD | 1,50% |
Please note that the twist & bow value is increased above average, if the copper balance of the PCB is locally very unequal or if the circuit board is very thin.
| Surface | RoHS-compliant | Soldering | Bonding aluminium wire | Bonding gold wire | BGAs | Flex-/Rigid-Flex | Press-fit Technology | Gold Fingers | Sliding contacts | Thickness | Shelf life | Reflow Cycles |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Hal SnPb |  | | >5µm | ca.12 Monate | 5** | |||||||
| HAL Lead free | | | | laut IPC-6012* | ca. 12 Monate | 5** | ||||||
| Chemical tin | | | | | >1µm | ca. 6 Monate | 5** | |||||
| Chemical silver | | | | | | 0.12 - 0.3µm | ca. 6 Monate | 5** | ||||
| Chemical Gold ENIG | | | | | | | 3-6µm Ni 0.05-0.1µm Au | ca. 12 Monate | 5** | |||
| ENEPIG | | | | | | | 3-8µm Ni 0.05-0.15µm Pd 0.05-0.1µm Au | ca. 12 Monate | - | |||
| Galvanic softgold | | | | 4 - 6µm Ni >1µm Au | ca. 12 Monate | - | ||||||
| Galvanic hardgold | | | | 4 - 6µm Ni 0.8 - 2µm Au | ca. 12 Monate auf Anfrage | - |
| Type | Coating thickness |
|---|---|
| On the PCB | > 10µm |
| On the conductor edge | > 5µm |
| Pieces | Tolerance |
|---|---|
| 1 - 20 pcs. | Excess or short delivery 0% |
| from 21 pcs. | Excess or short delivery of up to 10% |
On request, we also deliver quantities of more than 20 pieces in exact quantities, without under- or over-delivery.
The (single) piece rule also applies when ordering as panel.
Additional information
- DRC, E-Test, A.O.I., X-RAY, CCD - OIR quality control
- Overview of technical options
- Design-Aid