The standard layer buildups for metal core circuit boards are as follows. Please also observe the technical options for metal core circuit boards.
Layer buildup Metal Core 1 layer 35µm Cu
![Layer buildup Metal Core 1 layer 35µm Cu Layer buildup Metal Core 1 layer 35µm Cu](https://www.multi-circuit-boards.eu/fileadmin/_processed_/9/f/csm_metal-core_1_layer_35um_2ed293cca6.gif)
Layer buildup Metal Core 1 layer 140µm Cu
![Layer buildup Metal Core 1 layer 140µm Cu Layer buildup Metal Core 1 layer 140µm Cu](https://www.multi-circuit-boards.eu/fileadmin/_processed_/a/4/csm_metal-core_1_layer_140um_74bb85350f.gif)
Layer buildup Metal Core 2 layers plated-through
![Layer buildup Metal Core 2 layers plated-through Layer buildup Metal Core 2 layers](https://www.multi-circuit-boards.eu/fileadmin/_processed_/c/e/csm_metal-core_2_layers_pth_6fc3108fe5.gif)
Additional information:
- Design-Rules for layer buildups
- Technical options for Metal Core boards
- Available prepregs, cores, and foils
- Series, Prototypes, Flex, Rigid-Flex, Metal Core standard layer buildup
- Metal Core boards available technology